VGTimes Report from ADATA’s CES 2026 Booth: Highlights from a Leading Memory and Storage Manufacturer

During CES 2026, VGTimes Editor-in-Chief Rodion Ilin took a look at the latest products from ADATA — a major manufacturer of memory and storage solutions specializing in DRAM, SSDs, and flash products for both consumer and professional markets. Many of the company’s technologies and gaming-oriented products were showcased in Las Vegas under the XPG brand.

The presentation was led by ADATA representative Luca Di Fiore. He began with a look at ADATA’s latest high-density memory developments, starting with four-rank DDR5 CU-DIMMs. He explained that these modules represent a world-first showcase announced in coordination with major motherboard vendors at CES. The prototype shown had just come out of the lab and demonstrated the ability to address four memory ranks within a single module.

Each module offers a capacity of 64 GB, which means that next-generation motherboards and CPUs will be able to support up to 256 GB of memory per system, compared to the current 192 GB limit. Di Fiore noted that higher memory density typically comes with a performance penalty, but in this case, four-rank addressing allows the memory to maintain high frequencies. The demonstrated DRAM operates at an effective data rate of 7,200 MT/s, showing that increased capacity no longer requires a significant sacrifice in speed. He described the module as a laboratory showcase of what future high-density CU-DIMM designs will look like.

Moving on to consumer-oriented memory, Di Fiore highlighted ADATA’s strong focus on sustainability. One example was the NovaKey RGB memory, part of the company’s Project Infinity design language. He pointed out that infinity-mirror aesthetics are currently popular in gaming hardware, and NovaKey embraces that trend while also emphasizing eco-conscious design. Around 50 percent of the metal and 85 percent of the plastic used in the product are recycled materials. He added that ADATA’s management undergoes mandatory ESG training every month, underscoring how seriously the company takes sustainability when launching new products.

The presentation then shifted to external storage solutions. Di Fiore introduced the SR800, a compact external SSD designed primarily for smartphone users. The drive magnetically attaches to a phone, doubles as a stand, and can be used by creators who frequently shoot video on mobile devices. He also showcased an ultra-compact external SSD Project Bullet X with capacities up to 4 TB, delivering read speeds of up to 4,000 MB/s and write speeds of up to 3,800 MB/s.

Another storage product he highlighted was Project TapSafe. This external SSD uses recycled plastic and incorporates NFC-based security. Data on the drive is encrypted, and users authenticate access via their smartphone using NFC, for example through fingerprint recognition, turning the phone into a secure access key.

Di Fiore also emphasized ADATA’s leadership in flash memory standards, noting that the company was first to market with both microSD 7.1 Express and SD 8.0 Express cards. He pointed out that microSD 7.1 Express is particularly relevant now, offering capacities up to 1 TB and high speeds well suited for devices like the Nintendo Switch 2. Beyond consumer storage, he mentioned ADATA’s extensive work in compact memory packaging for AIoT applications, such as smart glasses. Thanks to in-house wafer cutting and NAND repackaging capabilities, ADATA can deliver highly customized solutions for embedded devices.

The presentation then moved to power supplies under ADATA’s gaming brand, XPG. Di Fiore noted that XPG is among the top five power supply vendors globally. He highlighted XPG Fusion as the brand’s flagship model — a fully digital 1,600 W power supply. He recalled demonstrating it at Computex two years earlier, where it successfully powered four overclocked RTX GPUs at 2,100 W. Fusion features full software control, a 12-year warranty, and advanced diagnostics, including a “black box” function that allows engineers to analyze failure logs and improve future designs.

Building on that vision, Di Fiore explained that XPG has transitioned this technology into its third-generation Platinum power supply platforms. The first generation focused on silence and efficiency, the second on ATX 3.1 compliance, and the third on software-level intelligence. These new models feature software connectivity and GPU overcurrent protection. Instead of instantly cutting power when an issue is detected, the system performs a controlled shutdown, protecting the GPU and the rest of the system. This platform is known as CyberCore 3.

He described CyberCore 3 as the most power-dense power supply in the world, delivering 1,000 W in an ultra-compact SFX form factor. The clean internal design and high-quality terminals allow XPG to achieve this density without increasing the physical size.

Di Fiore also discussed XPG’s renewed approach to semi-modular power supplies, aimed primarily at system integrators. While integrators often request simplified, cheaper configurations with fewer cables, XPG believes this limits long-term upgradability. The company therefore continues to offer semi-modular designs that preserve expandability, ensuring end users are not locked into compromised configurations.

He concluded the power supply segment by highlighting XPG Pylon 2, the company’s best-selling Bronze-rated platform. Di Fiore noted that approximately one percent of all DIY PC builds last year used a Pylon unit — an impressive figure given the number of power supply SKUs on the market. The platform uses an LLC topology typically found in Gold-rated power supplies, effectively delivering Gold-level design at a Bronze price point.

The focus then shifted to peripherals, starting with gaming chairs. Di Fiore introduced Nimbus, XPG’s new mesh chair line. Positioned as an entry-level model, Nimbus offers strong ergonomics, adjustable lumbar support, solid metal construction, and a target price of around $200. He then presented Nexus Plus, a higher-end mesh chair with full mesh coverage, adjustable headrest, and fine-tunable lumbar support for more precise seating adjustment.

Next came Project Dock, one of the most talked-about XPG concepts at CES 2026. Project Dock is an open-bench chassis built around XPG’s “exoskeleton” design philosophy, where form directly supports function. The chassis features interchangeable magnetic panels, including glass and metal designs with XPG’s Mera character IP. The motherboard can be mounted horizontally, vertically, or rotated for different layouts, and nearly all components attach magnetically, including displays and accessory mounts.

Project Dock also supports dual power supplies and even dual systems, making it appealing for streamers who want separate machines for gaming and streaming. Di Fiore emphasized flexibility as the core principle behind the design.

Integrated into Project Dock is a prototype airflow system called “Dynamic Breathing.” Di Fiore explained that XPG’s Hurricane Mag fans already support magnetic attachment and reversible airflow. The next step is full software control via USB, eliminating the need for external controller hubs. This allows the system to dynamically adjust fan direction and speed based on workload — for example, prioritizing GPU cooling during gaming or CPU cooling during rendering.

The system can detect fan failures in real time, redistribute airflow through remaining fans, and maintain safe operation while the user replaces faulty hardware. By dynamically controlling intake and exhaust, the system improves thermal efficiency, reduces noise, and delays thermal throttling.

The presentation continued with a showcase of recent modding contest winners, built using XPG chassis such as the VALOR Micro-ATX case and the Starker Air BTF, one of XPG’s best-selling RGB-focused gaming cases. Di Fiore also briefly mentioned new monitors, including 24- and 27-inch models with refresh rates ranging from 120 Hz up to 200 Hz, and hinted at future dual-mode displays.

He then introduced OceanView, XPG’s flagship dual-chamber chassis concept. First shown at Computex, the design has been refined based on feedback and is set to launch in Q2 at a price of $159 without fans.

Finally, Di Fiore moved on to XPG’s cooling solutions, stressing that ease of installation is a core principle behind their design. He then demonstrated how cooling solutions can be installed in the Invader X Elite chassis, highlighting support for top-mounted radiators and an overall layout designed to make installation easier and cleaner, especially for larger cooling setups.

He introduced the Hurricane Clip fan lineup, which uses a clip-based mounting system with a single connector handling both RGB and PWM control, significantly reducing cable clutter and simplifying installation.

After that, Di Fiore presented the Maestro View 62DA, a dual-tower air cooler equipped with an integrated display. Positioned as a more affordable alternative to liquid cooling solutions, it supports up to 250 W of thermal load. The display is magnetically attached, making installation and orientation adjustments straightforward.

Separately from the cooler, Di Fiore showcased a curved OLED display module designed to be mounted inside a PC chassis. This display is not part of the cooler itself but a standalone component intended for case integration. It attaches magnetically and can be positioned in different orientations inside the chassis.

The curved OLED display is paired with proprietary software that uses forced-perspective projection. By accounting for the system’s placement and the user’s viewing position, the software adjusts visuals so standard video content appears correctly on the curved surface. Di Fiore noted that this approach ensures proper alignment and visual consistency — an area where, in his view, many competing solutions fall short.

He concluded by explaining that XPG aims to solve both hardware and software challenges together, delivering not just striking designs, but systems that adapt intelligently to how users actually interact with their PCs.

Article by Rodion Ilin and Fazil Dzhyndzholiia.

VGTimes has been operating since 2011 and during this time has attended dozens of exhibitions and festivals where our journalists gathered numerous exclusive materials. For example, in 2019 we attended a closed Cyberpunk 2077 showing at gamescom, in 2017 we prepared a photo report from WG Fest, in 2020 we were at Central Asia's largest gaming event CAGS, and we also visited "IgroMir" several times, where we saw Hideo Kojima and other famous developers. Last year, we traveled to the land of the rising sun for TGS 2024, where we were amazed by the scale of the event. And this year we saw with our own eyes one of Asia's major gaming exhibitions — ChinaJoy in Shanghai and gamescom asia in Bangkok.