AMD Unveils New Ryzen AI 400 Processors and Embedded Solutions at CES 2026

AMD used the CES 2026 stage to unveil a significant expansion of its AI processor lineup. The announcement covered both the consumer mobile segment and specialized solutions for industry and automotive. The foundation of the laptop refresh is the Ryzen AI 400 platform, also known under the codename Gorgon Point. The new chips are built on a hybrid Zen 5 and Zen 5c architecture and feature RDNA 3.5 graphics. The family comprises seven models, ranging from the Ryzen AI 5 430 up to the flagship Ryzen AI 9 HX 475.

In essence, the new series is a refined version of last year's Ryzen AI 300. According to AMD, the Ryzen AI 9 HX 470 shows a 12% advantage in gaming scenarios and up to a 71% lead in productivity workloads compared to the competing Intel Core Ultra 9 288V. The most notable improvements are seen in the top-tier 12-core models:

A separate focus was the launch of the Ryzen AI Embedded P100 and X100 series. These processors are intended for automotive digital cockpits, industrial automation, and physical AI systems, including robotics. The P100 Series combines up to 6 Zen 5 cores, RDNA 3.5 graphics, and an XDNA 2 NPU with performance up to 50 TOPS. Key features of these solutions include operation in extreme temperature ranges (from -40°C to +105°C) and support for a lifecycle of up to 10 years.

Alongside the consumer chips, AMD also introduced corporate Ryzen AI PRO 400 versions with enhanced security features and updated Ryzen AI Max+ models with an improved graphics subsystem.

Laptop manufacturers will begin releasing devices with Ryzen AI 400 in the first quarter of 2026. The embedded P100 processors are currently in the sampling phase for key customers, with plans for volume production to start in the second quarter.