Major Memory Manufacturers to Halt DDR3 and DDR4 Production in 2025

The world's leading DRAM manufacturers — Samsung Electronics, SK Hynix, and Micron—are preparing for significant changes in the memory market. According to industry sources, these companies may cease production of DDR3 and DDR4 modules entirely by the end of 2025, shifting their focus to DDR5 and high-bandwidth memory (HBM).

The discontinuation of older memory standards could result in DDR3 and DDR4 shortages as early as the second half of 2025. Analysts warn that once production stops, existing stockpiles will come under pressure, with supply largely dependent on Taiwanese manufacturers such as Nanya Technology and Winbond. However, even they are unlikely to fully offset the potential deficit.

The key reason for phasing out DDR3 and DDR4 is the industry’s shift in priorities. Major manufacturers are focusing on high-speed memory modules essential for server solutions, artificial intelligence, and cloud computing. In response to this trend, Winbond plans to transition to a 16nm process, enabling it to produce 8-gigabit memory chips.

According to Nanya Technology’s forecasts, the DRAM market will hit a low point in early 2025, followed by a recovery driven by rising demand and improved inventory management. Moving forward, the primary focus will be on DDR5 and HBM, offering superior bandwidth and energy efficiency.

While Samsung and SK Hynix aim to concentrate on cutting-edge memory modules, other manufacturers, including China’s CXMT, may step in to capture the DDR4 market. However, experts remain skeptical that this will fully compensate for the withdrawal of the industry’s biggest players from older standards. As a result, the transition to DDR5 appears inevitable, and users reliant on DDR3 and DDR4 may face rising prices and limited module availability in the coming years.