AMD Testing Zen 6 Energy-Efficient Processors for Ultrabooks

Information about an early engineering sample of AMD's next-generation mobile processor has been discovered in the databases of the customs service NBD. The chip in question carries the codename Medusa 1 and is based on the Zen 6 architecture.

According to the published information, the sample has an early A0 stepping and a rated thermal design power (TDP) of 28W. This indicates the processor belongs to an energy-efficient lineup intended for thin and light laptops. The document corroborates earlier leaks about the future Medusa Point family being split into two groups: high-power (45W) and low-power (28W).

Technical details gathered from various sources allow for a preliminary picture of the new product. The low-voltage lineup, which will include Ryzen 5 and Ryzen 7 models, will feature a hybrid core structure. A configuration of 4 standard, 4 dense, and 2 low-power compute cores is expected (4C (Classic) + 4D (Dense) + 2LP (Low Power)). This will mark AMD's first use of low-power cores in x86 mobile processors, while the higher-performance Ryzen 9 versions could feature up to 22 cores.

All chips in the family will use the unified FP10 socket. As for integrated graphics, analysts do not foresee major changes. It's highly likely that Medusa Point will retain the current RDNA 3.5 architecture. A transition to a new graphics core, such as RDNA 5 or UDNA, isn't expected before 2027.

The appearance of an early sample in shipping documents suggests AMD has entered the internal testing phase for its future mobile processors. The market does not expect an official announcement and the start of shipments for these new products before 2027, with the current year likely dedicated to refreshing existing lineups.