Intel Unveils 14A Node, Moves Toward 3D Chip Design

At the Intel Foundry Direct 2025 event held in San Jose, Intel showcased several advancements in its chip manufacturing roadmap. The spotlight was on its latest process technologies and packaging methods, including the new 14A, along with 18A-P and 18A-PT variants.

The 14A node, which follows the current 18A process, has already attracted early customers. It’s designed for test chip production using the second-generation backside power delivery system (PowerVia) and upgraded RibbonFET transistors. One of the key innovations debuting with 14A is Turbo Cells — a new technology aimed at boosting clock speeds and optimizing the balance between performance and power efficiency. While Intel hasn’t shared technical specifics yet, the company says Turbo Cells will allow compute blocks to dynamically adapt to the needs of specific applications.

Intel is also advancing its 18A process, which has now entered the pre-production phase. Two new extensions are in development alongside it: 18A-P, geared toward higher performance, and 18A-PT, built specifically for 3D chip stacking using Foveros Direct 3D and hybrid bonding technology. This approach enables chips to be stacked vertically, reducing latency and improving density — a strategy already adopted by competitors like AMD with its 3D V-Cache tech.

Intel representatives emphasized the company’s commitment to local manufacturing and expanding its technology stack through vertical integration and long-term partnerships with clients and ecosystem players.